LBS-M

Spot shape:	Square, rectangle, ring, circle
Beam type:	Flat top light, high gloss
Laser power:	60, 100, 150, 200（W）
Wavelength:	975（nm）
Spot size:	100 * 100 ~ 300 * 300（μm） 300 * 300 ~ 900 * 900（μm） 900 * 900 ~ 2700 * 2700（μm）
Spot uniformity:	Over 95%
Laser head size:	122 * 40 * 220 （mm）
Laser size:	456 * 397 * 146（mm）

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The LBS-M laser bonding system is commonly used in the semiconductor and electronics industries to replace existing massive reflow soldering (MR) processes, equipped with ultra high speed closed-loop control pyrometers. Compared to massive reflow soldering and hot pressing bonding, the LBS-M laser bonding system has multiple advantages:
① short heating process, strong targeting, and higher productivity;
② The heating process is more efficient and energy consumption is lower;
③ Higher quality solder joints, smaller warping, lower thermal stress between the chip and substrate, and no thermal stress outside the bonding interface, reducing the risk of chip damage;
④ Suitable for more types of substrates, thus achieving narrower spacing applications.
In addition, the control software used in the entire system – LASCON ^® Software, with real-time temperature measurement and adjustment of laser energy function, universal TCP/IP protocol for easy integration by customers; The software script writing process is simple and easy to get started, making the use and operation of the laser system more convenient and efficient; Can save 500000 processes and 255 process control scripts.

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Product Details
Product parameters
Software
Application

1、 Compared to massive reflow soldering and hot pressing bonding, laser assisted bonding has multiple advantages:

① Higher yield rate.

High thermal stresses results in bending which causes 3 types of poor quality solder joints：
①Non-wet joints. Seen in schematic 1 edges and 2 middle.
②Streched joints. Seen in schematic 1 and 2.
③Bridge joints. Seen in schematic 1 middle and 2 edges.

Low thermal stresses results in healthy joints.

② The heating process is short, targeted, and can bring higher production efficiency; The heating process is more efficient and consumes less energy.

(Comparison of temperature curves between laser assisted bonding and reflow furnace processes)

2、 Product advantages:

1、Temperature control

Lascon® controller is connected to the laser. It allows for fast, precise, and accurate material surface temperature control.

The figure shows that the laser system changes the laser temperature through high-speed closed-loop control of the pyrometer feedback, achieving the predetermined temperature curve.

2.Uniform and shaped laser spot

Our top hat beam profile has high beam uniformity. Sharp contours prevent damage to surrounding areas.

Plastic shaped light spots and compatible products.

Laser system specifications
Serial Number	Parameter	Unit	Details
1	Laser power	W	60, 100, 150, 200
2	Wavelength	nm	975
3	Power adjustment range	%	0~100
4	Pilot light	–	Yes
5	Fiber core diameter	µm	200 or customized
6	Numerical aperture	–	0.22
7	Fiber length	m	3, 5 or customized
8	Connector	–	SMA905 or D80
9	Input voltage	V	200~240（50-60Hz）
10	Operating mode	–	Continous wave (CW)
11	Maximum modulation frequency	Hz	20000
12	Control mode	–	External control touch screen, RS232 serial port, analog AD
13	Dimensions (L×W×H)	mm	456 * 397 * 146
14	Weight	Kg	10.5
15	Cooling method	–	air cooling
16	Working temperature	℃	15-30
17	Storage temperature	℃	5-50
18	Cooling requirement	–	10 cm open space around it
19	Laser safety class	–	DIN EN 60825-1, class 4

Laser head specifications
Serial Number	Parameter	Unit	BSH500
1	Power limit	W	up to 500
2	Spectral range	nm	975
3	Optics	–	1″, AR coated, 23mm max aperture
4	Fibre connector	–	FSMA905, D80, LLK-A (connection of various fibre laser collimators available)
5	Fibre diameter	µm	100 – 600
6	Numerical aperture	–	0.22
7	Pilot laser	–	Class 2. Wavelength 650nm +/- 10nm, via fibre coupled pyrometer
8	Ambient temperature	℃	5-55 for operation, no condensation
9	Dimensions	mm	122 * 40 * 220
10	Weight	kg	1.4
11	Protection	–	IP50
12	CE label	–	According to EU directives for electromagnetic immunity
13	Conformity	–	The RoHS Directive 2011/65/EU of 2011-06-08 with supplement from 2015-03-31 is fulfilled
14	Camera	–	USB2.0 1280 x 1024, coaxial with pyrometer and laser
15	0.8kg without the camera

Controller specifications
Serial Number	Parameter	Unit	Details
1	Temperature range	℃	100 – 2200
2	Spectral range	µm	1.65 – 2 / 1.65 – 2.5
3	Accuracy (e=1, t90=1s, T=25℃)	–	< 1500℃ 0.3% +/- 2K
4	Repeatability	–	0.1% +/- 1K
5	Resolution	℃	0.1
6	Response time	ms	1
7	Emissivity	–	0.01 – 1
8	Analog output	V	0-10 (16Bit configurable using software)
9	Power supply	–	24V DC, max. 2A
10	Data storage	–	internal, 500.000 processes, 255 process control scripts
11	Optical fibre length	m	3, 5 or customized
12	Ambient temperature	℃	max 40
13	CE label	–	According to EU directives for electromagnetic immunity
14	Conformity	–	The RoHS Directive 2011/65/EU of 2011-06-08 with supplement from 2015-03-31 is fulfilled
15	Software	–	LASCON^® software
16	Position	–	Coaxial

LASCON^® is the process monitoring system with probably the largest distribution in the laser industry. More than 1500 users worldwide in industry and research monitor and regulate their laser processes with LASCON^®.

The LASCON Process Manager uses the infrared or 2 color pyrometers to measure the temperature on the workpiece 10,000 times per second and compares the measured temperature with a specified setpoint temperature. From the difference, the systems calculated the rated power for the laser system. This laser system is controlled by an analogue signal so that any laser system can be used with analog voltage power input. But it can also control inductors and other heat sources. The processes are monitored, stored and visualized. The process data of each process can additionally be exported automatically to an external server. Easily programmable scripts can be used to set monitors around setpoint temperatures to create an error signal if the measured temperature is not within the temperature monitor. Especially for laser soldering, the solder wire feeder can also be parameterized and started by software from the script.

Semiconductor applications

The rapid development of the semiconductor industry requires achieving smaller spacing, thinner substrates, and high-quality chip bonding. Laser assisted bonding technology is suitable for advanced semiconductor packaging with high demand for precise heating control in speed, accuracy, local and even extremely small areas. Compared to traditional reflow soldering and TCB, laser assisted bonding does not require additional measures to avoid thermal expansion. It has obvious advantages in bonding temperature, operation time, and heat affected zone size, making it the best choice for direct bonding of high-precision chips.

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