Semiconductor applications

The rapid development of the semiconductor industry requires achieving smaller spacing, thinner substrates, and high-quality chip bonding.Laser assisted bonding technology is suitable for advanced semiconductor packaging with high demand for precise heating control in speed, accuracy, local and even extremely small areas. Compared to traditional reflow soldering and TCB, laser assisted bonding does not require additional measures to avoid thermal expansion. It has obvious advantages in bonding temperature, operation time, and heat affected zone size, making it the best choice for direct bonding of high-precision chips.